| Image | Mfr Part # | Series | Package | Product Status | Type | Input Type | Output Type | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|
|
ZSSC3135BA1D
DICE (WAFER SAWN) - WAFFLE PACK
|
* | Tray | Active | - | - | - | - | - | - | - |
|
|
ZSSC3036CC1C
DICE (WAFER SAWN) - FRAME
|
* | Tray | Active | - | - | - | - | - | - | - |
|
|
ZSSC3230BC1D-ES
IC CAP SENSOR SIGNAL COND ENG SM
|
- | Bulk | Active | Capacitive Sensor | Analog, Digital | I²C | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
|
|
ZSSC3224BI2B
WAFER (UNSAWN) - BOX
|
* | Tray | Active | - | - | - | - | - | - | - |
|
|
ZSSC3015NE1D
DICE (WAFER SAWN) - WAFFLE PACK
|
* | Tray | Active | - | - | - | - | - | - | - |
|
|
ZSC31050FIB
WAFER (UNSAWN) - BOX
|
* | Tray | Active | - | - | - | - | - | - | - |
|
|
ZSSC3241DI5C
WAFER (SAWN) - FRAME
|
- | Tape & Reel (TR) | Active | Signal Conditioner | Analog, Digital | 1-Wire®, I²C, SPI | -40°C ~ 125°C (TA) | Surface Mount | Die | Wafer |
|
|
ZSSC3036CI1D ES
DICE (WAFER SAWN) - WAFFLE PACK
|
* | Tray | Active | - | - | - | - | - | - | - |
|
|
ZSSC3123AA1C
DICE (WAFER SAWN) - FRAME
|
* | Tray | Active | - | - | - | - | - | - | - |
|
|
ZSC31014EIC
DICE (WAFER SAWN) - FRAME
|
* | Tray | Active | - | - | - | - | - | - | - |
|
|
ZSC31015EAC
DICE (WAFER SAWN) - FRAME
|
* | Tray | Active | - | - | - | - | - | - | - |
|
|
ZSSC3015NE1C
DICE (WAFER SAWN) - FRAME
|
* | Tray | Active | - | - | - | - | - | - | - |