| Image | Mfr Part # | Series | Package | Product Status | Type | Input Type | Output Type | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|
|
ZSSC4161DE1C-APB
TESTED DIE, SAWN ON FOIL -CFG 41
|
- | - | - | - | - | - | - | - | - | - |
|
ZSSC3026CC1C
DICE (WAFER SAWN) - FRAME
|
* | Tray | Active | - | - | - | - | - | - | - |
|
ZSSC3122AI1B
WAFER (UNSAWN) - BOX
|
* | Tray | Active | - | - | - | - | - | - | - |
|
U2720-XS1421C
DICE (WAFER SAWN) - FRAME
|
* | Tray | Obsolete | - | - | - | - | - | - | - |
|
ZSC31150GEC
DICE (WAFER SAWN) - FRAME
|
* | Tray | Active | - | - | - | - | - | - | - |
|
ZSSC3240BC3R-ES
IC SENSOR SIGNAL CONDITIONER
|
- | Tape & Reel (TR) | Obsolete | - | - | - | - | - | - | - |
|
ZSSC3240BI2B
IC SENSOR SIGNAL CONDITIONER
|
- | Bulk | Obsolete | - | - | - | - | - | - | - |
|
ZSSC3036CI1B
WAFER (UNSAWN) - BOX
|
* | Tray | Active | - | - | - | - | - | - | - |
|
ZSSC3026CC1B
WAFER (UNSAWN) - BOX
|
* | Tray | Active | - | - | - | - | - | - | - |
|
ZSSC4169DE5R-APC
TSSOP / 16 / 5X4MM-0
|
- | - | - | - | - | - | - | - | - | - |
|
ZSSC3218BI1D ES
DICE (WAFER SAWN) - WAFFLE PACK
|
* | Tray | Active | - | - | - | - | - | - | - |
|
ZSSC3241DI5B
WAFER (UNSAWN) - WAFER BOX
|
- | Tape & Reel (TR) | Active | Signal Conditioner | Analog, Digital | 1-Wire®, I²C, SPI | -40°C ~ 125°C (TA) | Surface Mount | Die | Wafer |