Products1029Record(s)
Image Mfr Part # SeriesPackageProduct StatusTypeInput TypeOutput TypeOperating TemperatureMounting TypePackage / CaseSupplier Device Package
ZSSC4161DE1C-APB
TESTED DIE, SAWN ON FOIL -CFG 41
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ZSSC3026CC1C
DICE (WAFER SAWN) - FRAME
*TrayActive-------
ZSSC3122AI1B
WAFER (UNSAWN) - BOX
*TrayActive-------
U2720-XS1421C
DICE (WAFER SAWN) - FRAME
*TrayObsolete-------
ZSC31150GEC
DICE (WAFER SAWN) - FRAME
*TrayActive-------
ZSSC3240BC3R-ES
IC SENSOR SIGNAL CONDITIONER
-Tape & Reel (TR)Obsolete-------
ZSSC3240BI2B
IC SENSOR SIGNAL CONDITIONER
-BulkObsolete-------
ZSSC3036CI1B
WAFER (UNSAWN) - BOX
*TrayActive-------
ZSSC3026CC1B
WAFER (UNSAWN) - BOX
*TrayActive-------
ZSSC4169DE5R-APC
TSSOP / 16 / 5X4MM-0
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ZSSC3218BI1D ES
DICE (WAFER SAWN) - WAFFLE PACK
*TrayActive-------
ZSSC3241DI5B
WAFER (UNSAWN) - WAFER BOX
-Tape & Reel (TR)ActiveSignal ConditionerAnalog, Digital1-Wire®, I²C, SPI-40°C ~ 125°C (TA)Surface MountDieWafer
1 42 43 44 45 46 47 48 49 50 86
RFQ