| Image | Mfr Part # | Series | Package | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Primary Attributes | Operating Temperature | Peripherals |
|---|---|---|---|---|---|---|---|---|---|---|---|
|
TDA4VM88T5BALFRQ1
PROTOTYPE
|
- | - | - | - | - | - | - | - | - | - |
|
|
TDA3MVSB1FABFRQ1
PROTOTYPE
|
- | - | - | - | - | - | - | - | - | - |
|
|
TDA3MVRB1ABFRQ1
PROTOTYPE
|
- | - | - | - | - | - | - | - | - | - |
|
|
TDA4VM88TGCALFR
NEXT GENERATION SOC FAMILY FOR L
|
- | Tape & Reel (TR) | - | - | - | - | - | - | - | - |
|
|
TCI6636K2HDXAAWA24
PROTOTYPE
|
KeyStone Multicore | Bulk | - | DSP, MPU | C66x, Quad ARM® Cortex®-A15 MPCore™ with CoreSight™ | - | - | - | -40°C ~ 100°C (TC) | - |
|
|
TCI6630K2LSCMSAT
PROTOTYPE
|
KeyStone Multicore | Bulk | - | DSP, MPU | Dual ARM® Cortex®-A15 MPCore™ with CoreSight™ | - | - | - | -40°C ~ 100°C (TC) | - |
|
|
TDA4AL88TGAALZRQ1
AUTOMOTIVE SYSTEM-ON-A-CHIP FOR
|
Automotive, AEC-Q100 | Tape & Reel (TR) | - | DSP, MCU, MPU | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | - | - | - | -40°C ~ 125°C (TJ) | - |
|
|
TDA2SABRQABCQ1
SOC PROCESSOR W/ HIGHLY-FEATURED
|
- | Tray | - | DSP, MPU | ARM® Cortex®-A15, Dual ARM® Cortex®-M4, C66x | - | - | - | -40°C ~ 125°C (TJ) | - |
|
|
TCI6636K2HDAAWA24T
PROTOTYPE
|
KeyStone Multicore | Bulk | - | DSP, MPU | C66x, Quad ARM® Cortex®-A15 MPCore™ with CoreSight™ | - | - | - | -40°C ~ 100°C (TC) | - |
|
|
TDA2HABDQAAS2RQ1
PROTOTYPE
|
- | Bulk | - | - | - | - | - | - | - | - |
|
|
TCI6630K2LXCMS
PROTOTYPE
|
KeyStone Multicore | Bulk | - | DSP, MPU | Dual ARM® Cortex®-A15 MPCore™ with CoreSight™ | - | - | - | 0°C ~ 100°C (TC) | - |
|
|
DRA821U4TCBALMRQ1
PROTOTYPE
|
Automotive, AEC-Q100 | Bulk | - | - | - | - | - | - | -40°C ~ 125°C (TJ) | - |